RCT i-Tex
best in class productivity
RCT i-Tex
Saw damage removal and single- / double-sided
isotropic texturing for multi Si wafers
RCT i-Tex is designed to remove the saw damage of multicrystalline wafers and textures the wafer surface for best antireflection behavior. lt is optimized for lowest CoO by low chemical consumption, stable processes and small footprint.
optimized hydrodynamics in metal impurity cleaning
Advantages
- Single-side texturing technology for 35% chemical and disposal cost saving available
- Optimized cost of ownership: up to 30% reduced DI water consumption and compact footprint
by integration of chiller into main module - Best in class productivity: less than one hour for bath change and unique quick-lock system
of spray bars for easy and fast maintenance - Advanced alkaline cleaning design to avoid KOH contamination
- Surface near frequent chemical exchange for high-performance metal impurity cleaning
Technical Data
| Process | Inline saw damage etch and acidic texturization |
| Nominal Throughput | 3,600 wafer/h, 5 lanes |
| Conveyor Speed | 0.5 – 2.5 m/min, nominal 2.1 m/min |
| Dimensions | 8880 x 2200 x 2120 mm³ (L x W x H) |
| Wafer Size | 156 × 156±0.5mm / 156.75 × 156.75±0.25mm, ≥ 150 µm |
| Etch Depth Range | 3.5 - 4.5 µm |
| Bath Lifetime | > 700,000 wafers |
| Breakage Rate | < 0.05% |
Learn more:
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