RCT i-Tex
best in class productivity
RCT i-Tex is designed to remove the saw damage of multicrystalline wafers and textures the wafer surface for best antireflection behavior. lt is optimized for lowest CoO by low chemical consumption, stable processes and small footprint.
optimized hydrodynamics in metal impurity cleaning
Process | Inline saw damage etch and acidic texturization |
Nominal Throughput | 3,600 wafer/h, 5 lanes |
Conveyor Speed | 0.5 – 2.5 m/min, nominal 2.1 m/min |
Dimensions | 8880 x 2200 x 2120 mm³ (L x W x H) |
Wafer Size | 156 × 156±0.5mm / 156.75 × 156.75±0.25mm, ≥ 150 µm |
Etch Depth Range | 3.5 - 4.5 µm |
Bath Lifetime | > 700,000 wafers |
Breakage Rate | < 0.05% |