RCT i-Clean

flexible cleaning tool

RCT i-Clean

Inline SiO2 / PSG / BSG etching and cleaning
for multi and mono Si wafer

RCT i-Clean is a flexible cleaning tool for either immersion or single sided processing. It is suitable for etching of dielectric layers, SiO2 / PSG / BSG removal or prediffusion cleaning.

Advantages

  • Optimized cost of ownership: up to 30% reduced DI water consumption and compact footprint
    by integration of chiller into main module
  • Best in class productivity: less than one hour for bath change and unique quick-lock system
    of spray bars for easy and fast maintenance
  • Surface near frequent chemical exchange for high-performance metal impurity cleaning

Technical Data

Process Inline cleaning, single sided or immersed
Nominal Throughput 3,600 wafer/h, 5 lanes
Conveyor Speed 0.5 – 2.5 m/min, nominal 2.1 m/min
Dimensions 8880 x 2200 x 2120 mm³ (L x W x H)
Wafer Size 156 × 156±0.5mm / 156.75 × 156.75±0.25mm, ≥ 150 µm

Interested in RCT i-Clean technology?
For further information contact our team.

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